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pc817x series 1. recognized by ul1577 (double protection isolation), file no. e64380 (as model no. pc817 ) 2. package resin : ul flammability grade (94v-0) features agency approvals/compliance 1. i/o isolation for mcus (micro controller units) 2. noise suppression in switching circuits 3. signal transmission between circuits of different po- tentials and impedances applications dip 4pin general purpose photocoupler 1. 4pin dip package 2. double transfer mold package (ideal for flow solder- ing) 3. high collector-emitter voltage (v ceo :80v ( * ) ) 4. current transfer ratio (ctr : min. 50% at i f =5 ma, v ce =5v) 5. several ctr ranks available 6. high isolation voltage between input and output (v iso(rms) : 5.0 kv) ( * ) up to date code "p7" (july 2002) v ceo : 35v. from the production date code "j5" (may 1997) to "p7" (july 2002), however the products were screened by bv ceo 70v. ? 4-channel package type is also available. (model no. pc847x series ) description pc817x series contains an ired optically coupled to a phototransistor. it is packaged in a 4pin dip, available in wide-lead spacing option and smt gullwing lead-form option. input-output isolation voltage(rms) is 5.0kv. collector-emitter voltage is 80v ( * ) and ctr is 50% to 600% at input current of 5ma. 1 sheet no.: d2-a03101en date sep. 30. 2003 ?sharp corporation notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification sheets before usin g any sharp device. pc817x series
internal connection diagram anode cathode emitter collector 1 1 2 3 4 2 4 3 2 sheet no.: d2-a03101en outline dimensions product mass : approx. 0.21g (unit : mm) 1. through-hole [ex. pc817x ] 2. smt gullwing lead-form [ex. pc817xi ] 3. wide through-hole lead-form [ex. pc817xf ] 4. wide smt gullwing lead-form [ex. pc817xfp ] 6.5 0.5 7.62 0.3 4.58 0.5 : 0 to 13? epoxy resin 3.5 0.5 3.0 0.5 0.5 typ. 0.6 0.2 1.2 0.3 1 2 4.58 0.5 2.54 0.25 4 3 anode mark rank mark factory identification mark date code pc817 2.7 0.5 0.5 0.1 0.26 0.1 0.6 0.2 1.2 0.3 6.5 0.5 7.62 0.3 0.26 0.1 4.58 0.5 2.54 0.25 epoxy resin 3.5 0.5 4.58 0.5 2.54 0.25 4 3 anode mark rank mark factory identification mark date code 1.0 + 0.4 ? 0 1.0 + 0.4 ? 0 10.0 + 0 ? 0.5 0.35 0.25 1 2 pc817 pc817 4.58 0.5 0.6 0.2 1.2 0.3 1.0 0.1 2.54 0.25 6.5 0.5 anode mark factory identification mark date code 4 3 7.62 0.3 10.16 0.5 0.26 0.1 4.58 0.5 0.5 0.1 epoxy resin 3.5 0.5 2.7 min. rank mark 1 2 pc817 0.6 0.2 1.2 0.3 1.0 0.1 6.5 0.5 10.16 0.5 0.75 0.25 0.75 0.25 4.58 0.5 2.54 0.25 anode mark rank mark factory identification mark date code 4 3 7.62 0.3 12.0 max 4.58 0.5 epoxy resin 3.5 0.5 0.26 0.1 0.5 0.1 0.25 0.25 1 2 pc817x series
date code (2 digit) rank mark refer to the model line-up table a.d. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 mark a b c d e f h j k l m n mark p r s t u v w x a b c mark 1 2 3 4 5 6 7 8 9 o n d month january february march april may june july august september october november december a.d 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2nd digit month of production 1st digit year of production factory identification mark factory identification mark no mark country of origin japan indonesia philippines china * this factory marking is for identification purpose only. please contact the local sharp sales representative to see the actural status of the production. 3 repeats in a 20 year cycle sheet no.: d2-a03101en pc817x series
sheet no.: d2-a03101en electro-optical characteristics parameter conditions forward voltage peak forward voltage reverse current collector dark current transfer characteristics collector current collector-emitter saturation voltage isolation resistance floating capacitance cut-off frequency min. ? ? ? ? 2.5 ? 5 10 10 ? ? ? ? typ. 1.2 ? ? ? ? 0.1 1 10 11 0.6 80 4 3 max. 1.4 3.0 10 100 30.0 0.2 ? 1.0 ? 18 18 unit v v a na ma v ? pf khz s s symbol v f v fm i r i ceo i c v ce (sat) r iso f c t r t f c f response time rise time fall time i f = 20ma i fm = 0.5a v r = 4v terminal capacitance ? 30 250 pf c t v = 0, f = 1khz v ce = 50v, i f = 0 i f = 5ma, v ce = 5v i f = 20ma, i c = 1ma v = 0, f = 1mhz v ce = 2v, i c = 2ma, r l = 100 ? v ce = 5v, i c = 2ma, r l = 100 ? , ? 3db dc500v, 40 to 60%rh (t a = 25?c) *5 from the production date code "j5" (may 1997) to "p7" (july 2002), however the products were screened by bv ceo 70v. collector-emitter breakdown voltage 80 ?? v bv ceo i c = 0.1ma, i f = 0 emitter-collector breakdown voltage 6 ?? v bv eco i e = 10 a, i f = 0 input output *5 absolute maximum ratings (t a = 25?c) parameter symbol unit input forward current ma *1 peak forward current a power dissipation mw output collector-emitter voltage v emitter-collector voltage v collector current ma collector power dissipation mw total power dissipation mw *2 isolation voltage operating temperature ?c storage temperature ?c *3 soldering temperature i f i fm p v ceo v eco i c p c p tot v iso (rms) t opr t stg t sol ?c *1 pulse width 100 s, duty ratio : 0.001 *2 40 to 60%rh, ac for 1minute, f=60hz *3 for 10s *4 up to date code "p7" (july 2002) v ceo : 35v. rating 50 1 reverse voltage v v r 6 70 80 6 50 150 200 ? 30 to + 100 ? 55 to + 125 260 5.0 kv *4 4 pc817x series
sheet no.: d2-a03101en model line-up lead form package through-hole pc817x PC817X1 pc817x2 pc817x3 pc817x4 pc817x5 pc817x6 pc817x7 pc817x8 pc817x9 pc817x0 wide through-hole pc817xf pc817xf1 pc817xf2 pc817xf3 pc817xf4 pc817xf5 pc817xf6 pc817xf7 pc817xf8 pc817xf9 pc817xf0 pc817xi pc817xi1 pc817xi2 pc817xi3 pc817xi4 pc817xi5 pc817xi6 pc817xi7 pc817xi8 pc817xi9 pc817xi0 taping pc817xp pc817xp1 pc817xp2 pc817xp3 pc817xp4 pc817xp5 pc817xp6 pc817xp7 pc817xp8 pc817xp9 pc817xp0 wide smt gullwing pc817xfp ? ? ? ? ? ? ? ? ? ? sleeve 2 000pcs/reel 100pcs/sleeve smt gullwing model no. i c [ma] (i f = 5ma, v ce = 5v, t a = 25?c) rank mark with or without a b c d a or b b or c c or d a, b or c b, c or d a, b, c or d 2.5 to 30.0 4.0 to 8.0 6.5 to 13.0 10.0 to 20.0 15.0 to 30.0 4.0 to 13.0 6.5 to 20.0 10.0 to 30.0 4.0 to 20.0 6.5 to 30.0 4.0 to 30.0 5 please contact a local sharp sales representative to inquire about production status and lead-free options. pc817x series
sheet no.: d2-a03101en current transfer ratio ctr (%) forward current i f (ma) 0.1 1 10 0 800 700 600 500 400 300 200 100 v ce = 5v t a = 25?c fig.6 current transfer ratio vs. forward current duty ratio 5 5 pulse width 100 s t a = 25?c 10 20 100 50 200 500 2 10 ? 3 10 ? 2 52 10 ? 1 525 peak forward current i fm (ma) 1 10 000 5 000 2 000 1 000 fig.5 peak forward current vs. duty ratio 6 pc817x series forward current i f (ma) ambient temperature t a (?c) 0 50 40 30 20 10 ? 30 0 25 50 55 75 100 125 fig.1 forward current vs. ambient temperature diode power dissipation p (mw) ambient temperature t a (?c) 0 100 80 70 60 40 20 ? 30 0 25 50 55 75 100 125 fig.2 diode power dissipation vs. ambient temperature collector power dissipation p c (mw) ambient temperature t a (?c) 0 250 200 150 100 50 ? 30 0 25 50 75 100 125 fig.3 collector power dissipation vs. ambient temperature fig.4 total power dissipation vs. ambient temperature total power dissipation p tot (mw) ambient temperature t a (?c) 0 250 200 150 100 50 ? 30 0 25 50 75 100 125
sheet no.: d2-a03101en collector-emitter saturation voltage v ce (sat) (v) forward current i f (ma) 0 0 1 2 3 4 5 510 6 15 7ma 1ma 3ma 5ma i c = 0.5ma t a = 25?c fig.12 collector-emitter saturation voltage vs. forward current 5 5 5 5 5 5 80 60 40 20 0 ? 30 100 10 ? 5 10 ? 6 10 ? 7 10 ? 8 10 ? 9 10 ? 10 10 ? 11 collector dark current i ceo (a) ambient temperature t a (?c) v ce = 50v fig.11 collector dark current vs. ambient temperature relative current transfer ratio ( % ) 0% 150% 100% 50% ? 40 0 ? 20 20 40 60 80 100 ambient temperature t a (?c) i f = 1ma, v ce = 5v i f = 5ma, v ce = 5v fig.9 relative current transfer ratio vs. ambient temperature 0 0.02 0.04 0.06 0.08 0.10 0.12 0.14 collector-emitter saturation voltage v ce (sat) (v) i f = 20ma i c = 1ma ambient temperature t a (?c) ? 40 0 ? 20 20 40 60 80 100 fig.10 collector - emitter saturation voltage vs. ambient temperature 7 pc817x series 50?c 25?c 0?c 0 2 0.5 1.0 1.5 2.0 2.5 3.0 3.5 5 10 20 50 100 200 500 1 ? 25?c t a = 75?c forward current i f (ma) forward voltage v f (v) fig.7 forward current vs. forward voltage 0 0 5 1 10 15 20 25 30 23456789 20ma 10ma 5ma collector current i c (ma) collector-emitter voltage v ce (v) i f =30ma p c (max.) t a =25?c fig.8 collector current vs. collector-emitter voltage
sheet no.: d2-a03101en frequency f (khz) ? 20 0 0.5 1 2 5 ? 10 200 100 50 20 10 500 1k ? 100 ? voltage gain a v (db) r l = 10k ? v ce = 5v i c = 2ma t a = 25?c fig.15 frequency response v cc r l output please refer to the conditions in fig.15. r d v ce fig.16 test circuit for frequency response remarks : please be aware that all data in the graph are just for reference and not for guarantee. 8 pc817x series v cc t f t r t s 90% 10% t d output input r l input output r d please refer to the conditions in fig.13. v ce fig.14 test circuit for response time fig.13 response time vs. load resistance 0.01 0.1 1 10 500 200 50 0.2 0.5 2 10 0.1 1 5 20 100 50 response time ( s) v ce = 2v i c = 2ma t a = 25?c t s t d t f t r load resistance r l (k ? )
sheet no.: d2-a03101en design considerations while operating at i f <1.0ma, ctr variation may increase. please make design considering this fact. this product is not designed against irradiation and incorporates non-coherent ired. degradation in general, the emission of the ired used in photocouplers will degrade over time. in the case of long term operation, please take the general ired degradation (50% degradation over 5years) into the design consideration. recommended foot print (reference) ? for additional design assistance, please review our corresponding optoelectronic application notes. 9 smt gullwing lead-form wide smt gullwing lead-form 10.2 2.54 1.7 2.2 8.2 2.54 1.7 2.2 (unit : mm) design guide pc817x series
sheet no.: d2-a03101en manufacturing guidelines reflow soldering: reflow soldering should follow the temperature profile shown below. soldering should not exceed the curve of temperature profile and time. please don't solder more than twice. soldering method flow soldering : due to sharp's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. flow soldering should be completed below 270?c and within 10s. preheating is within the bounds of 100 to 150?c and 30 to 80s. please don't solder more than twice. hand soldering hand soldering should be completed within 3s when the point of solder iron is below 400?c. please don't solder more than twice. other notices please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and pcb varies depending on the tooling and soldering conditions. 10 1234 300 200 100 0 0 (?c) terminal : 260?c peak ( package surface : 250?c peak) preheat 150 to 180?c, 120s or less reflow 220?c or more, 60s or less (min) pc817x series
sheet no.: d2-a03101en solvent cleaning: solvent temperature should be 45?c or below immersion time should be 3minutes or less ultrasonic cleaning: the impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of pcb and mounting method of the device. therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. recommended solvent materials: ethyl alcohol, methyl alcohol and isopropyl alcohol in case the other type of solvent materials are intended to be used, please make sure they work fine in ac- tual using conditions since some materials may erode the packaging resin. cleaning instructions this product shall not contain the following materials. and they are not used in the production process for this device. regulation substances:cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform) specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. presence of odc 11 pc817x series
sheet no.: d2-a03101en package specification 12 12.0 6.7 5.8 10.8 15.0 6.35 5.9 10.8 520 2 520 2 sleeve package 1. through-hole or smt gullwing lead-form package materials sleeve : hips (with anti-static material) stopper : styrene-elastomer package method max. 100pcs of products shall be packaged in a sleeve. both ends shall be closed by tabbed and tabless stoppers. the product shall be arranged in the sleeve with its anode mark on the tabless stopper side. max. 20 sleeves in one case. sleeve outline dimensions (unit : mm) (unit : mm) 2. wide through-hole lead-form or wide smt gullwing lead-form package materials sleeve : hips (with anti-static material) stopper : styrene-elastomer package method max. 100pcs of products shall be packaged in a sleeve. both ends shall be closed by tabbed and tabless stoppers. the product shall be arranged in the sleeve with its anode mark on the tabless stopper side. max. 20 sleeves in one case. sleeve outline dimensions pc817x series
sheet no.: d2-a03101en 13 tape and reel package 1. smt gullwing package materials carrier tape : ps cover tape : pet (three layer system) reel : ps carrier tape structure and dimensions f k e i d j g b h h a c 5? max. dimensions list (unit : mm) a 16.0 0.3 b 7.5 0.1 c 1.75 0.1 d 8.0 0.1 e 2.0 0.1 h 10.4 0.1 i 0.4 0.05 j 4.2 0.1 k 5.1 0.1 f 4.0 0.1 g 1.5 + 0.1 ? 0 a c e g f b d dimensions list (unit : mm) a 330 b 17.5 1.5 c 100 1.0 d 13 0.5 e 23 1.0 f 2.0 0.5 g 2.0 0.5 pull-out direction [packing : 2 000pcs/reel] reel structure and dimensions direction of product insertion pc817x series
sheet no.: d2-a03101en 2. wide smt gullwing package materials carrier tape : ps cover tape : pet (three layer system) reel : ps carrier tape structure and dimensions 14 dimensions list a 24.0 0.3 b 11.5 0.1 c 1.75 0.1 d 8.0 0.1 e 2.0 0.1 h 12.4 0.1 i 0.4 0.05 j 4.1 0.1 k 5.1 0.1 f 4.0 0.1 g 1.5 + 0.1 ? 0 (unit : mm) j g i e c b a h h 5? max. f d k a c e g f b d dimensions list (unit : mm) a 330 b 25.5 1.5 c 100 1.0 d 13 0.5 e 23 1.0 f 2.0 0.5 g 2.0 0.5 pull-out direction [packing : 2 000pcs/reel] reel structure and dimensions direction of product insertion pc817x series
?the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems rela- ted to any intellectual property right of a third party re- sulting from the use of sharp's devices. ?contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the spec- ifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufac- turing locations are also subject to change without no- tice. ?observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: --- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connec- tion with equipment that requires an extremely high lev- el of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment --- medical and other life support equipment (e.g., scuba). ?if the sharp devices listed in this publication fall with- in the scope of strategic products described in the for- eign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp de- vices. ?this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be repro- duced or transmitted in any form or by any means, elec- tronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. ?contact and consult with a sharp representative if there are any questions about the contents of this pub- lication. 15 sheet no.: d2-a03101en important notices pc817x series

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